ETSI adopts of MIPI I3C Basic into ETSI Smart Secure Platform

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, and ETSI Technical Committee Secure Element Technologies (TC SET) announced the adoption of the I3C Interface for SSP (TS 103 818) specification, allowing the MIPI I3C Basicspecification to serve as a physical and logical

[Hot] Industry’s smallest 2MP & 1.5MP CMOS sensors

Teledyne e2v markets its Topaz series of industrial CMOS sensors with new 2MP and 1.5MP resolution devices. These 1920 x 1080 and 1920 x 800-pixel format sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact mobile designs for

Major update to MIPI CSI-2 camera specification enables next-generation always on, low power and machine vision applications

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced a significant update to its MIPI Camera Serial Interface 2 (MIPI CSI-2) interface to enable advanced machine-vision applications in multiple application spaces, such as mobile, augmented and virtual reality, drones, the Internet of Things (IoT), medical devices, industrial systems,

MIPI Alliance releases A-PHY v1.1, doubling maximum data rate and adding new implementation options to automotive SerDes interface

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the release of MIPI A-PHY v1.1, the next version of the automotive serializer-deserializer (SerDes) physical-layer interface. Version 1.1 doubles the maximum available downlink data rate from

콩가텍, 차세대 Qseven 모듈 conga-QMX8-Plus 출시

임베디드 및 에지 컴퓨팅 기술 분야 선도 기업 콩가텍 코리아(대표 김윤선)가 NXP i.MX 8M 플러스 애플리케이션 프로세서에 기반한 신규 Qseven 모듈 conga-QMX8-Plus를 출시했다고 밝혔다. Qseven 컴퓨터 온 모듈 출시 15주년에 맞춰 출시된 conga-QMX8-Plus은 현장에서 운용되고 있는 NXP i.MX 6 기반의 Qseven 모듈을 대체할

Introspect Technology announces world’s first MIPI C-PHY Version 2.0 and D-PHY Version 3.0 Combo Analyzer

Introspect Technology, a specialist manufacturer of test and measurement tools for high-speed digital applications, unveiled the SV5C-DPRXCPRX Combo MIPI D-PHY/C-PHY Analyzer. This ultra-compact instrument enables electrical characterization and protocol validation of components based on the latest MIPI Alliance® C-PHY and D-PHY specifications, especially those targeting C-PHY version 2.0

IEEE adopts MIPI A-PHY, first industry-standard, long-reach SerDes physical layer interface for automotive applications

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the adoption of the MIPI A-PHY v1.0 specification as an IEEE standard. Published as IEEE 2977-2021, IEEE Standard for Adoption of MIPI Alliance Specification for A-PHY Interface (A-PHY) Version 1.0, A-PHY is