TDK Corporation(https://www.tdk.com) has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection. This product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at […]
Richardson RFPD (www.richardsonrfpd.com) announced the availability and full design support capabilities for a robust family of silicon carbide semiconductor devices from Wolfspeed, a Cree Company. According to Wolfspeed, the E-Series line of SiC MOSFETs represents the industry’s first automotive-qualified, PPAP-capable and humidity-resistant MOSFETs. The devices include Wolfspeed’s third-generation rugged planar technology, featuring the industry’s lowest […]
TDK (www.tdk.com) has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection. This product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at […]
Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that its 200 V Qspeed™ diodes – LQ10N200CQ and LQ20N200CQ – are now available with AEC-Q101 automotive qualification. Qspeed silicon diodes use merged-PIN technology to offer a unique balance of soft switching and low reverse recovery charge (Qrr). This […]
Plug-and-play interoperability between luminaires and sensors and communication modules is an essential requirement for Smart City lighting. This has been the primary motivation for the collaboration between the Zhaga Consortium and the Digital Illumination Interface Alliance (DiiA) over the upcoming Zhaga-D4i specifications. Both organisations are therefore proud to announce that booth C17 at the LED […]
Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18, in Munich, Germany. Karch will present Flux Systems in Solder Pastes: The Demands on Electrical Reliability are Increasing. He will discuss how the advancing electricification of automobiles and the increase in operating hours often associated with plug-in […]
Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China. Yan’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned. […]
KDPOF Will Demo Galvanic Isolation of Gigabit Ethernet POF at IEEE-SA Technology Day and ELIV VDI Congress KDPOF, leading supplier for gigabit transceivers over POF (Plastic Optical Fiber), announced that the first application of a Battery Management System (BMS) based on optical connectivity will soon go into production. “We are delighted that by the end […]
Indium Corporation, in cooperation with industry partners MicroCare and Weller, will host a half-day, reliability-focused technical symposium at SMTA Atlanta on September 12 in Peachtree Corners, Georgia. The SMTA Atlanta Reliability Symposium is the most recent in a series of technical symposiums hosted by Surface Mount Technology Association (SMTA). The event brings together global leaders […]
Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston, Massachusetts. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the […]
