New 175°C AEC-Q101 MOSFETs in miniature leadless packages from Nexperia enable automated inspection

New 175°C AEC-Q101 MOSFETs in miniature leadless packages from Nexperia enable automated inspection

Nexperia announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175 °C and are available in the AOI-compatible DFN2020 package (DFN = Discrete Flat No leads). More, the new devices measure just 2 mm x 2 mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.

Nexperia 175°C AEC-Q101 MOSFETs

Nexperia 175°C AEC-Q101 MOSFETs

Many leadless packages cannot be inspected using AOI techniques, so Nexperia pioneered the development of the DFN2020 package with side-wettable flanks (SWF), enabling Automatic optical inspection (AOI) – a critical automotive industry requirement – to be employed. Packages with SWF are now a proven, accepted solution.

Comments Malte Struck, Nexperia’s product manager for small signal MOSFETs: “The DFN package with side-wettable flanks is gaining significant traction with automotive manufacturers as it saves space and can be automatically inspected. Our new 175 °C parts are being used in under-the-hood applications, especially near the engine or gearbox. The unique offering of an automotive-grade MOSFET that is both qualified to 175 °C and which incorporates side-wettable flanks makes the DFN2020 additionally suitable for a wide range of medium-power automotive applications.”

The new automotive-qualified parts extend Nexperia’s low and medium power MOSFET portfolio. Six 40 V and 60 V devices are available with the higher temperature rating and automotive approval, each with low RDS(on) of between 20 mΩ and 40 mΩ.

More information on the new DFN2020 MOSFETs (BUKxxx) including product specs and datasheets is available at https://efficiencywins.nexperia.com/efficient-products/DFN2020-Automotive-MOSFETs.html

답글 남기기

이메일은 공개되지 않습니다. 필수 입력창은 로 표시되어 있습니다.

Loading…
Loading…
Loading…

뉴스 모음

Loading…

시장 및 솔루션 분석