UP Bridge the Gap, a brand of AAEON – a leading manufacturer of AI Edge hardware solutions – announced a partnership with Hailo, a leading Artificial Intelligence (AI) chipmaker, to meet skyrocketing demands for next-generation AI applications at the edge. The latest UP Bridge the Gap platforms are
Tag: NPU
Nextchip and emotion3D deliver ultra-efficient driver and occupant monitoring package based on APACHE5 platform
Nextchip, a world-leading provider of highly efficient automotive embedded platforms, and emotion3D, one of the global top automotive in-cabin analysis software vendors, teamed up to provide one of the market’s most efficient embedded platform and software packages for driver and occupant monitoring. Based
Avnet Edge AI Development Kit enables high performance edge processing with low-power on-chip accelerators
Avnet’s new development kit enables OEM design engineers to deploy autonomous artificial intelligence (AI) capabilities to embedded applications, thereby reducing or eliminating the dependency on cloud connectivity or processing. The Avnet Edge AI Development Kit features Avnet Embedded’s robust SMARC Computer-on-module (COM), based on
DSP Group unveils DBM10 low-power edge AI/ML SoC with dedicated neural network inference processor
DSP Group, a specialist provider of wireless and voice-processing chipset solutions for converged communications, announced the DBM10, a low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system on chip (SoC). The SoC comprises a digital signal processor (DSP) and the company’s nNetLite