Thin Film Electronics, a developer of ultrathin, flexible, and safe energy storage solutions for wearable devices and connected sensors, unveiled the next phase of its strategy to support the commercialization of the company’s premium microbattery products based on solid-state lithium battery (“SSLB”)
GOWIN Semiconductor announces AEC-Q100 automotive grade FPGA availability
GOWIN Semiconductor released its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain. AEC-Q100 has been in place for over 20 years defining the reliability qualification requirements for Automotive integrated circuits. To get a certificate meeting the AEC-Q100 Grade 2
[Design Focus] Ambiq’s Apollo4 SoC for higher intelligence without sacrificing battery life
Ambiq's Apollo4 SoC family is the 4th generation system processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT) platform. The complete hardware and software solution enables the battery-powered endpoint devices of tomorrow to achieve a higher level of intelligence without sacrificing
WISeKey’s VaultIC microprocessor secures Cold Wallets, offering security and ease-of-use for bitcoin and other cryptocurrency users
WISeKey International announced that its semiconductor VaultIC secures Cold Wallets with a contactless hardware that enables the wallet to offer security and ease-of-use to Bitcoin and other cryptocurrency users. Cold Wallets are the safest option to store private keys as these wallets are not
[Tech Watch] Digital light source for deeper 3D LiDAR
The first step in designing a 3D LiDAR (light detection and ranging) sensor is to pick a laser source for generating photons to illuminate the scene. Each LiDAR has a receiver which collects and processes the light reflected back from the targets
EPC releases physics-based models projecting eGaN® device lifetime in new reliability report
EPC announced its Phase-12 Reliability Report, documenting the strategy used to achieve a remarkable field reliability record. eGaN devices have been in volume production for more than 11 years and have demonstrated very high reliability in over 226 billion hours of operation,
JEDEC Wide Bandgap Power Semiconductor Committee publishes new test method for continuous-switching evaluation of GaN power conversion devices
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP182: Test Method for Continuous-Switching Evaluation of Gallium Nitride Power Conversion Devices. Developed by JEDEC’s JC-70 Committee for Wide Bandgap Power Electronic Conversion
로데 슈바르즈, 5G NR IMS Test Case의 PTCRB Validation 완료
로데슈바르즈(Rohde & Schwarz)는 자사의 5G NR IMS 프로토콜 인증 시험 Test Case가 업계 최초의 PTCRB Validation을 완료했다고 발표했다. 로데슈바르즈는 이미 2008년도에 업계 최초의 IMS Test Case의 Validation을 완료한 바 있다. 기존 LTE 인증 시험과 이동통신 사업자 인증 시험 분야의 지원을 통해 꾸준히 기술을
[Design Focus] 3A low IQ synchronous buck converter with best-in-class EMI performance
Diodes' AP63300 and AP63301 are 3A, synchronous buck converters with a wide input voltage range of 3.8V to 32V supporting 5V, 12V, and 24V power supplies. Integrated 75mΩ high-side and a 40mΩ low-side power MOSFETs provide high efficiency step-down DC-DC conversion. The AP63300
슈나이더 일렉트릭, ‘글로벌 지속가능경영 100대 기업’ 1위 선정
코퍼레이트 나이츠 의 2021 글로벌 지속가능경영 100대 기업 발표… 8000개 이상의 기업 중 1위 차지 에너지 관리 및 자동화 분야의 디지털 혁신을 선도하고 있는 글로벌 기업 슈나이더 일렉트릭(www.se.com/kr/ko/, 한국지사 대표 김경록)이 코퍼레이트 나이츠 (Corporate Knights)가 선정한 글로벌 지속가능경영 100대 기업(Global 100 Most Sustainable